Abstract:
This research investigates the reasons for inverter building project failures. Most of
the projects which are based on inverter circuit design fail due to switching spikes
and/or malfunction of IGBT/MOSETs. This paper discusses the reasons for
inverter circuit failures and propose some remedial actions to mitigate the
identified problems. The problems created due to electromagnetic interference
(EMI) can be handled during printed circuit board (PCB) developing stage through
proper segregation of the components, managing PCB layers effectively and
shielding jumper connecting wires between the circuits. A special protective circuit
is developed to overcome the short circuiting of the IGBT/MOSFETs due to their
malfunction. Designing an effective heat dissipation method (heat sink) is also
addressed. The efficacy of the proposed methods to improve the reliability of the
inverter circuit is experimentally verified through a hardware prototype of an
inverter.
